Minimally invasive medicine is evolving rapidly with the help of cutting-edge materials and novel fabrication strategies. This talk by Daniil Karnaushenko (TU Chemnitz) presents breakthrough techniques in self-assembly that enable the creation of complex 3D microelectronic structures from planar substrates. These structures, incorporating both rigid and flexible components, open new possibilities for integrating electronics and actuation into microsurgical tools and biomedical sensors. Join us to learn how these innovations are pushing the boundaries of what’s possible in electronic skin and next-gen medical devices.